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Die Bonder Equipment Market forecast to grow at a CAGR of 4% From 2022-2032 | FMI

Global Die Bonder Equipment demand is anticipated to be valued at US$ 4.2 Billion in 2022, forecast to grow at a CAGR of 4% to be valued at US$ 6.0 Billion from 2022 to 2032. Growth is attributed to the increasing adoption of stacked die technology in the Internet of Things (IoT) devices.

A die bonder is essentially a system that aids in the placement of a semiconductor device, and die bonder equipment is a type of assembler and semiconductor packaging used to fabricate semiconductor devices.

A die bonder’s primary function is to remove the die from the wafer and attach it to a substrate. It is widely used in consumer electronics, automotive, industrial, telecommunications, healthcare, aerospace, and defense applications.

Increasing demand for electronic systems with an expanding number of end-use applications, as well as rising demand for semiconductor ICs, are expected to drive the growth of the Die Bonder Equipment Market during the forecast period.

The rising adoption of high-definition television, hybrid laptops, and rising urbanization will be the primary growth drivers for the Die Bonder Equipment market during the forecast period.

Other factors such as rising demand for 3D semiconductor assembly and packaging, the adoption of stacked die technology in the internet of things (IoT) enabled devices, and rising demand for semiconductor integrated circuits (ICs) are expected to drive market growth during the analysis period.

Moreover, the growing adoption of stacked die technology in IoT devices, and the increasing demand for miniature electronic components will further propel the growth of the Die Bonder Equipment market in the forthcoming years.

The die bonder equipment market in Asia Pacific is expected to hold the largest share of US$ 3.0 Billion. The regional market is expected to re at a CAGR of 3.3% during the forecast period.

The North America Die Bonder Equipment market is expected to hold a significant share during the forecast period, owing to rising demand for semiconductor ICs and rising urbanization in the region.

Furthermore, the increasing prevalence of a large number of manufacturers in the region, as well as the rising demand for tablets and smartphones, are the major factors expected to accelerate the growth of Die Bonder Equipment during the analysis period. The North American die bonder equipment market is expected to grow at a CAGR of 3.1%, reaching a market value of US$ 1.0 billion by 2022.

Key Players:

  • Besi
  • ASM Pacific Technology Limited (ASMPT)
  • Kulicke & Soffa Industries Inc.
  • Tresky AG
  • West·Bond, Inc.
  • Panasonic Corporation
  • MRSI Systems
  • Palomar Technologies
  • DIAS Automation
  • Toray Engineering

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