According to Fact MR’s latest analysis, the Die Attach Materials Market is expected to grow significantly between 2021 and 2031, surpassing a net valuation of US$ 900 million by 2031. Die attach material demand will grow at a steady pace in the short term, with a positive outlook for the long term.
The use of die-attach materials in the assembly of LEDs is expected to increase demand in the near future. Die-attach materials are expected to be in high demand due to the need to determine the reliability and performance characteristics of LEDs.
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Key Segments
By Form
- Powder
- Paste
- No clean pastes (NC)
- Rosin mildly activated pastes (RM)
- Water soluble pastes (WS)
- Wires
By Material
- Polymer Adhesives
- Polymides
- Epoxies
- Eutectic Die Attach Materials
By Application
- Industrial applications
- Commercial applications
What’s Driving Die Attach Material Demand?
Changing consumer electronics demand is expected to drive demand for electric circuit boards, which will in turn drive demand for die-attach materials. The growing use of die-attach materials in electronic components used in industry is due to the trend of miniaturisation of circuits across several industries.
Due to the facilitation of inefficient power flow, it is expected that demand for powder die attachment materials will decline. Furthermore, polymer die-bonding materials have excellent adhesion properties; as a result, they are a major focus for the manufacturer and are expected to gain traction in the die bonding material market.
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Who are the Key Manufacturers and Suppliers of Die Attach Materials?
Some of the leading manufacturers and suppliers of Die Attach Materials include
- Indium Corporation
- Alpha Assembly Solutions
- The Dow Chemical Company
- Henkel AG & Co. KGaA
- Hybond Inc.
- Creative Materials Inc.
- Al Technology Inc.
- BE Semiconductor Industries N.V.
- Master Bond Inc.
- Delo Industrie Klebstoffe GmbH & Co. KGaA
Die Attach Materials Sales are Driven by the Semiconductor Packaging Industry
Semiconductor packaging is one of the most important requirements in the global electronics industry. Die bonding materials are in high demand due to the rapidly growing demand for semiconductor packaging. A semiconductor package is a cover made of plastic, metal, ceramic, or glass that contains one or more semiconductor devices or integrated circuits. The package provides a means of interacting with the outside world.
The semiconductor packaging industry has begun to reduce costs while improving overall integrated circuit performance. In terms of packaging size, performance, and faster consumer consideration, market vendors are struggling with innovative delivery solutions. Apart from a wide range of semiconductor packaging applications, die bonding material is also in demand in the aerospace and defence industries.
